HOLLOW SEALING STRUCTURE

PROBLEM TO BE SOLVED: To provide a hollow sealing structure capable of maintaining a sealing state well even when high pressure is applied from the inside or the outside without causing very upsizing of the hollow sealing structure nor remarkable increase in manufacturing cost.SOLUTION: In a hollow...

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Bibliographic Details
Main Author IWASAKI TAKAAKI
Format Patent
LanguageEnglish
Published 12.09.2013
Subjects
BLASTING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CYLINDERS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ENGINEERING ELEMENTS AND UNITS
GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS
HEATING
LIGHTING
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MECHANICAL ENGINEERING
PISTONS
PRINTED CIRCUITS
SEALINGS
THERMAL INSULATION IN GENERAL
WEAPONS
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Summary:PROBLEM TO BE SOLVED: To provide a hollow sealing structure capable of maintaining a sealing state well even when high pressure is applied from the inside or the outside without causing very upsizing of the hollow sealing structure nor remarkable increase in manufacturing cost.SOLUTION: In a hollow sealing structure 10 wherein a first molded article 11 and a second molded article 12 are sealed through sealing molding materials 13, integration parts 11d, 12d for preventing the molded articles 11, 12 from separating from each other in a defection direction are respectively formed; and the sealing molding material 13 is arranged around a part at which the molded articles 11, 12 are butted against each other while the molded articles 11, 12 are integrated with each other by the integration parts 11d, 12d. By this structure, the molded articles 11, 12 are integrated with each other by the integration parts 11d, 12d, whereby a sealing state can be maintained well even when high pressure is applied thereto.
Bibliography:Application Number: JP20120046009