MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device.SOLUTION: In a semiconductor device 1, a semiconductor chip 8 mounted on a major surface of a package substrate 2 is sealed by a sealing member 11. On the major surface and a rear surface of the package substrate 2, wiring co...

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Main Authors MATSUURA TAKAO, IMURA KENICHI, TSUCHIYA KOJI, HASHIZUME TAKANORI, SUZUKI KAZUNARI, MIWA TAKASHI, ICHITANI MASAHIRO, SUZUKI MASAYUKI, TAKAHASHI NORIYUKI, NISHIDA TAKAFUMI
Format Patent
LanguageEnglish
Published 22.08.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device.SOLUTION: In a semiconductor device 1, a semiconductor chip 8 mounted on a major surface of a package substrate 2 is sealed by a sealing member 11. On the major surface and a rear surface of the package substrate 2, wiring conductor patterns 4 are disposed and dummy conductor patterns 4 are also disposed in regions where the wiring conductor patterns 4 are not formed. Increasing the density of the conductor patterns 4 in the package substrate 2 in the above described manner reduces warpage and swell of the package substrate 2 which are caused by thermal treatment in the manufacturing processes of the semiconductor device 1.
Bibliography:Application Number: JP20130114480