HEAT DISSIPATION STRUCTURE

• Main Author: KUSHIMA HAJIME
• Format: Patent
• Language: English
• Published: 22.08.2013
• Subjects: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CONTROL OR REGULATION THEREOF; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a heat dissipation structure which is easy to transmit heat of a heating element to a case, being suitable for manufacturing a case.SOLUTION: A heat dissipation structure 2 of an inverter 3 disclosed in a present specification includes a case 5 to which semiconductor modules 20 and 30 housing a heating element are fixed, and an undercover 4 fixed to the case 5. The semiconductor modules 20 and 30 are fixed to the case 5 at a plurality of fixing points 22 and 32 with grease held in between. The undercover 4 is made from a material whose thermal expansion coefficient is different from the case 5, and is fixed to the 5 so as to face the semiconductor modules 20 and 30 across a wall of the case 5. The fixing points 22 and 32 are provided to surround the heating element. Further, in a region surrounded with the fixing points, and on a case surface facing the semiconductor modules 20 and 30, a plurality of parallel linear grooves 8 and 9 are provided in which the grease enters. Between adjoining linear grooves, a flat surface which is wider than a groove width is provided.