SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing an external connection terminal located below a corner part of a semiconductor chip mounted on a wiring board from breaking due to a temperature cycle without increasing the size of the wiring board.SOLUTION: A semiconduct...

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Bibliographic Details
Main Author TOMOHIRO TAKASHI
Format Patent
LanguageEnglish
Published 01.08.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing an external connection terminal located below a corner part of a semiconductor chip mounted on a wiring board from breaking due to a temperature cycle without increasing the size of the wiring board.SOLUTION: A semiconductor device 10 comprises: a first semiconductor chip 14; a wiring board 11 having a wiring pattern 22 disposed on one surface and electrically connected to the first semiconductor chip 14 and a plurality of lands disposed on the other surface and electrically connected to the wiring pattern 22; and first to third external connection terminals 12A, 12B, and 12C provided on the plurality of lands. The wiring board 11 includes a stress dispersion pattern 27 facing the first external connection terminal 12A located below a corner part 14A of the first semiconductor chip 14 and the second external connection terminal 12B disposed outside the corner part 14A.
Bibliography:Application Number: JP20120008246