SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device using an adhesive member which ensures a favorable chip lamination property and favorable wire bondability.SOLUTION: A semiconductor device comprises a structure in which at least two semiconductor chips are stacked on a wiring board and the se...

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Bibliographic Details
Main Authors HOSOKAWA YOICHI, KANEDA MAIKO, MASUNO MICHIO, MATSUZAKI TAKAYUKI
Format Patent
LanguageEnglish
Published 25.07.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a semiconductor device using an adhesive member which ensures a favorable chip lamination property and favorable wire bondability.SOLUTION: A semiconductor device comprises a structure in which at least two semiconductor chips are stacked on a wiring board and the semiconductor chips adhere to each other with a film-like adhesive member having a total thickness of 150 μm and over. The adhesive member includes an adhesive layer which has a storage elastic modulus of 1 MPa and over after heat hardening and under a condition of 200°C when measured by a dynamic viscoelastic measurement device.
Bibliography:Application Number: JP20130093562