TOUCH PANEL WIRING STRUCTURE

PROBLEM TO BE SOLVED: To provide a touch panel wiring structure in which, when an insulating coat on a wiring pattern is subjected to dry etching to form a through hole, the wiring pattern and a connection pattern are reliably electrically connected in the through hole.SOLUTION: A metal oxide thin f...

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Bibliographic Details
Main Authors NAKAYAMA NAOMI, SUGAWARA HIROYUKI, IWAWAKI SHINYA
Format Patent
LanguageEnglish
Published 25.07.2013
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
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Summary:PROBLEM TO BE SOLVED: To provide a touch panel wiring structure in which, when an insulating coat on a wiring pattern is subjected to dry etching to form a through hole, the wiring pattern and a connection pattern are reliably electrically connected in the through hole.SOLUTION: A metal oxide thin film layer is put on at least part of a metal wiring pattern to form a wiring pattern, and the metal oxide thin film layer faces the inner bottom surface of a through hole, so as to prevent the metal wiring pattern from being oxidized and deteriorated in a process of dry etching.
Bibliography:Application Number: JP20120005913