LIGHT EMITTING DIODE PACKAGE

PROBLEM TO BE SOLVED: To provide a light emitting diode package achieving uniform light intensity and excellent color rendering properties.SOLUTION: A light emitting diode package according to the present invention includes: a substrate; an electrode structure installed on the substrate; a short wav...

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Bibliographic Details
Main Author LIN HSIN CHIANG
Format Patent
LanguageEnglish
Published 18.07.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a light emitting diode package achieving uniform light intensity and excellent color rendering properties.SOLUTION: A light emitting diode package according to the present invention includes: a substrate; an electrode structure installed on the substrate; a short wavelength light emitting diode chip and a long wavelength light emitting diode chip which are connected to the electrode structure; and a lens covering the short wavelength light emitting diode chip and the long wavelength light emitting diode chip. The lens includes: a converging portion for converging light, formed on an optical path of the long wavelength light emitting diode chip; and a diverging portion for diverging light, formed on an optical path of the short wavelength light emitting diode chip.
Bibliography:Application Number: JP20120282449