COOLING OF DATA CENTER

• Main Authors: BEAN JOHN H JR, HELD STEPHEN F, JOHNSON RICHARD J, JOHNSON ROLLIE R, FINK JAMES R
• Format: Patent
• Language: English
• Published: 04.07.2013
• Subjects: AIR-CONDITIONING, AIR-HUMIDIFICATION, VENTILATION, USE OF AIRCURRENTS FOR SCREENING; BLASTING; CALCULATING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEATING; LIGHTING; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MECHANICAL ENGINEERING; PHYSICS; PRINTED CIRCUITS; RANGES; VENTILATING; WEAPONS

PROBLEM TO BE SOLVED: To provide suitable cooling of a data center.SOLUTION: A modular data center includes a plurality of housings for housing electronic facility equipment to cool the electronic facility equipment and at least one panel for filling up a gap between housings. A first part of a housing is configured so as to hold the electronic facility equipment for generating heat, and a second part of the housing is configured so as to hold at least one cooling unit. Each of the first part is configured so as to hold the electronic facility equipment, wherein gas is brought in from a front surface of the facility equipment, the facility equipment causes hot gas, and the hot gas is discharged through the back of the housing. The housing and at least one panel surround a hot area from lateral sides, and are arranged and connected so as to regulate an opening of a top part so that the gas can come vertically out of the hot area. The back of the housing of the first part is arranged adjacently to the hot area so as to discharge the hot gas into the hot area.