EXPOSURE METHOD, DEVICE MANUFACTURING METHOD, AND EXPOSURE DEVICE

• Main Authors: SAKO NAOYA, KANAMARU YUKI, TOGUCHI MANABU
• Format: Patent
• Language: English
• Published: 04.07.2013
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; FREQUENCY-CHANGING; HOLOGRAPHY; MATERIALS THEREFOR; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF

PROBLEM TO BE SOLVED: To achieve high throughput.SOLUTION: An exposure device EX includes: an illumination system IS and a projection system PS that transfer a pattern including an alignment mark on a substrate P; a substrate stage 2 that moves the substrate P in a scanning direction while holding the substrate P; a first alignment system that measures a position of the alignment mark transferred on the substrate P; a second alignment system that is disposed at a position different from the first alignment system and measures a position of the alignment mark transferred on the substrate P; and a control device 5 that controls a correction value for correcting results of measuring by the first alignment system and the second alignment system in a subsequent process, using the result of measuring by the first alignment system in a preceding process.