HEAT TREATMENT APPARATUS

PROBLEM TO BE SOLVED: To provide a heat treatment apparatus capable of improving thermal efficiency and reducing surface roughing of a processed substrate even when heating a heated sample to at least 1200°C.SOLUTION: The heat treatment apparatus, which heats a heated sample 101, includes a hot plat...

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Bibliographic Details
Main Authors IZAWA MASARU, MIYAKE MASATOSHI, UEMURA TAKASHI, YOKOGAWA KATANOBU, SAKAI SATORU
Format Patent
LanguageEnglish
Published 20.06.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a heat treatment apparatus capable of improving thermal efficiency and reducing surface roughing of a processed substrate even when heating a heated sample to at least 1200°C.SOLUTION: The heat treatment apparatus, which heats a heated sample 101, includes a hot plate 103 for performing heat treatment for the heated sample 101 by heating using plasma formed in an area of a gap 108.
Bibliography:Application Number: JP20120092883