WIRING BOARD

PROBLEM TO BE SOLVED: To provide a wiring board which can reduce warp occurring in the wiring board by efficiently inhibiting decrease in intensity of a core material.SOLUTION: A wiring board according to an embodiment is a wiring board on which a semiconductor chip is mounted, and comprises: a core...

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Bibliographic Details
Main Authors SUZUKI KENJI, HIDA TOSHINORI
Format Patent
LanguageEnglish
Published 20.06.2013
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide a wiring board which can reduce warp occurring in the wiring board by efficiently inhibiting decrease in intensity of a core material.SOLUTION: A wiring board according to an embodiment is a wiring board on which a semiconductor chip is mounted, and comprises: a core material having a first principal surface and a second principal surface opposed to the first principal surface and in which a plurality of open holes penetrating from the first principal surface to the second principal surface are formed; a plurality of resin members filled in the plurality of open holes, respectively; a plurality of through holes formed in the plurality of resin members, respectively; and a plurality of through hole conductors formed on inner peripheral surfaces of the plurality of through holes, respectively and connected to a signal line, a power line and a ground line of the semiconductor chip. The through hole conductor connected to the signal line is formed in a region other than a mounting region of the semiconductor chip.
Bibliography:Application Number: JP20110270277