SUBSTRATE TEMPERATURE CONTROL FIXING APPARATUS AND METHOD OF MANUFACTURING THE SAME

• Main Authors: SHIMIZU KAZUNORI, NAGAI KOJI, KURIBAYASHI AKIHIRO, KOMATSU HIDEO
• Format: Patent
• Language: English
• Published: 17.06.2013
• Subjects: BASIC ELECTRIC ELEMENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING; ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERATION; MACHINE TOOLS; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a substrate temperature control fixing apparatus capable of being used at a higher temperature than before, and also to provide a method of manufacturing the same.SOLUTION: The substrate temperature control fixing apparatus includes: an electrostatic chuck which absorbs and holds an adsorption object; a base plate which fixes the electrostatic chuck; an adhesion layer formed between the electrostatic chuck and the base plate; and a heat insulation layer formed between the electrostatic chuck and the base plate. The electrostatic chuck includes: a base substance having a placement surface on which the absorption object is placed; an electric heating element which is directly formed on the surface opposite to the placement surface of the base substance; and an insulation layer formed so as to cover the electric heating element.