CONDUCTIVE PASTE AND CONDUCTIVE THIN FILM

PROBLEM TO BE SOLVED: To provide a conductive paste in which reduction in flex resistance is minimized and gas generation is suppressed, and to provide a conductive thin film formed by using this conductive paste.SOLUTION: The conductive paste contains a polyimide precursor solution or a polyimide s...

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Bibliographic Details
Main Author TANO TAKANORI
Format Patent
LanguageEnglish
Published 17.06.2013
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CONDUCTORS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
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Summary:PROBLEM TO BE SOLVED: To provide a conductive paste in which reduction in flex resistance is minimized and gas generation is suppressed, and to provide a conductive thin film formed by using this conductive paste.SOLUTION: The conductive paste contains a polyimide precursor solution or a polyimide solution, a metal capturing agent, and conductive particles. The metal capturing agent is any one kind of compound selected from a thiol compound represented by general formula (1) or a sulfide compound represented by general formula (2). Ar-SH ... (1) (In the formula (1), Ar represents a benzene ring, and may have a substituent group). (A-R'-O-R-S)... (2) (In the formula (2), R', R represents an alkylene group, and A represents a fluoroalkyl group).
Bibliography:Application Number: JP20110266480