LIGHT EMITTING DIODE MODULE

• Main Authors: NIWA KOICHI, NAKAZATO NORIO, SEKIGUCHI YOSHIFUMI, OKAZAKI CHOICHIRO, TANABE KOICHI, FUWA TAKESHI, TAKAGI HIROAKI
• Format: Patent
• Language: English
• Published: 13.06.2013
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a fluorescent layer structure and a light emitting diode module with an element arrangement structure capable of obtaining further efficient brightness.SOLUTION: A light emitting diode module in which a plurality of light emitting diode chips are mounted on a mounting surface of a rectangular plate shaped substrate with a good thermal conductivity, comprises a substrate formed of a member superior in thermal conductivity and having its outline in nearly rectangular shape. An element mounting surface with a predetermined shape is formed on a surface of the substrate, the plurality of light emitting diode chips are regularly arranged along a direction orthogonal to each other on the element mounting surface of the substrate, a frame-like dam member for forming a fluorescent layer in the light emitting diode chips are formed around the plurality of light emitting diode chips, and a ratio (h2/h1) of a height h2 of the fluorescent layer to a height h1 of the light emitting diode chip is 6 to 8 times.