FILM DEPOSITION APPARATUS AND FILM DEPOSITION METHOD

• Main Authors: TAMURA HISAHIRO, HIGUCHI KAORU
• Format: Patent
• Language: English
• Published: 06.06.2013
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; CONDUCTORS; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; INSULATORS; METALLURGY; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To provide a continuous type film deposition apparatus using a spray method capable of executing the film deposition of high quality on a substrate.SOLUTION: The film deposition apparatus includes a film deposition chamber 10 for executing the film deposition, a spray nozzle 25 for spraying a film deposition material 200, a conveying passage provided across the film deposition chamber 10, and a conveying mechanism for moving a substrate 100 on the conveying passage. A spray port 23a which introduces the film deposition material 200 atomized by the spray nozzle 25 into the film deposition chamber 10, and sprays the introduced film deposition material 200 toward the conveying passage side in the film deposition chamber 10 is formed in a wall part demarcating the film deposition chamber 10. A first exhaust port 24a is formed at a part located on the spray port 23a side when viewed from the conveying passage in the wall part demarcating the film deposition chamber 10. A second exhaust port 8a is formed in a part located opposite to the spray port 23a when viewed from the conveying passage in the wall part demarcating the film deposition chamber 10.