FILM DEPOSITION APPARATUS

• Main Authors: NISHIKAWA KAZUHIRO, MURAKAMI KOJI, TAMURA HISAHIRO
• Format: Patent
• Language: English
• Published: 30.05.2013
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To stabilize the quality of a film to be deposited by suppressing the production of particles.SOLUTION: A film deposition apparatus includes: a casing 150; a spraying mechanism having a spray port 130a for pulverizing a film deposition material 160 and spraying it in the casing 150; and a straightening member 132 having an outflow port 132b positioned on the opposite side of an inflow port 132a and the outflow port 132b facing the spray port 130a through a gap 133. A space between the inflow port 132a and the outflow port 132b of the straightening member 132 and the inside of the casing 150 are communicated with each other by the gap 133.