RESIN COMPOSITION, PREPREG USING THE SAME, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD

• Main Authors: SHIMIZU HIROSHI, MURAI YASUHIRO, TOMIOKA KENICHI, OHASHI KENICHI, AITSU SHUJI
• Format: Patent
• Language: English
• Published: 23.05.2013
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

PROBLEM TO BE SOLVED: To provide a resin composition having excellent flame retardancy, heat resistance and metal foil peel strength without containing a halogen compound, and a prepreg using the same, a metal-clad laminate and a printed wiring board.SOLUTION: The resin composition contains (a) a phosphinate represented by formula (1), (b) a thermosetting resin and (c) a curing agent for the thermosetting resin, wherein the phosphinate (a) has an average particle diameter of 2-5 μm and a specific surface area of 2.0-4.0 m/g. In formula (1), Rand Rmay be the same or different and denote linear or branched 1-6C alkyl and/or aryl; M is at least one metal selected from the group consisting of Mg, Ca, Al, Sb, Sn, Ge, Ti, Zn, Fe, Zr, Ce, Bi, Sr, Mn, Li, Na and K; and m is an integer of 1-4.