HEATER ELEMENT MOUNTING SUBSTRATE, MANUFACTURING METHOD OF THE SAME AND SEMICONDUCTOR PACKAGE

• Main Authors: IMAI NOBORU, NEMOTO MASANORI, TANOI MINORU, MATSUO NAGAYOSHI, ISAKA FUMIYA
• Format: Patent
• Language: English
• Published: 16.05.2013
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a heater element mounting substrate which has excellent thermal conductivity in a plate thickness direction though a single-sided wiring board and which is not likely to be influenced by an electrode position of the heater element to be mounted; and provide a manufacturing method of the heater element mounting substrate, a heater element mounting substrate providing a semiconductor package, a manufacturing method of the same and a semiconductor package.SOLUTION: A heater element mounting substrate 2 comprises: a resin film 20; a plurality of wiring patterns 21 formed on a first surface 20a of the resin film 20; and a plurality of filling parts 23 composed of a conductive material filled in a plurality of through holes 22 formed in the resin film 20. An area of at least one of the plurality of wiring patterns 21 is 30% and over of an area of the first surface 20a of the resin film 20. An area where the filling parts 23 and the wiring pattern 21 overlap each other when viewed from a second surface 20b side is 50% and over of an area of the wiring pattern 21. An LED element 3 is mounted on the resin film 20.