FORCED AIR COOLING HEAT SINK

• Main Author: TATSUKAWA MASAHIRO
• Format: Patent
• Language: English
• Published: 16.05.2013
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a forced air cooling heat sink in which a leeward-side semiconductor module can be cooled efficiently by decreasing a pressure loss and eliminating stagnation of an air stream.SOLUTION: Air (a windward-side air stream 7a) taken in from the outside via an intake port 12 passes through a windward-side air duct 8a, reaches a leeward-side air duct 8b through a gap between fins 3, passes through a cooling fan 5 and is emitted outside (leeward-side air stream 7b). On the other hand, air passing through the windward-side air duct 8a from a windward-side air duct opening 8c onto a base 2 is supplied to the fin 3 through an opening 9 of which the end face is deviated, formed between a windward-side semiconductor module 4a and a leeward-side semiconductor module 4b. As a result, the air (windward-side air stream 7a) passing from the outside through the windward-side air duct 8a and the windward-side air duct opening 8c onto the base 2 can be supplied to the leeward-side fin 3 without receiving heat radiation by the windward-side fin 3, thereby improving a leeward-side cooling performance.