METHOD AND APPARATUS FOR MEASURING RESIDUAL STRESSES IN COMPONENT

PROBLEM TO BE SOLVED: To provide a method of measuring through-thickness stress distribution in a workpiece by use of existing equipment without the need for any specialized equipment.SOLUTION: The method comprises: the step 44 of clamping a workpiece at a first position and a second position distan...

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Bibliographic Details
Main Author SIM WEI-MING
Format Patent
LanguageEnglish
Published 09.05.2013
Subjects
MEASURING
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE
PHYSICS
TESTING
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Summary:PROBLEM TO BE SOLVED: To provide a method of measuring through-thickness stress distribution in a workpiece by use of existing equipment without the need for any specialized equipment.SOLUTION: The method comprises: the step 44 of clamping a workpiece at a first position and a second position distant from the first position; the step of performing a first material removal operation at a third position between the first and second positions; the step 54 of releasing the workpiece at the second position; the step 56 of measuring a first deformation amount of the workpiece; and the step 60 of determining residual stresses in the workpiece from the first deformation amount.
Bibliography:Application Number: JP20120223044