THIN FILM FORMING APPARATUS

• Main Authors: AOYAMA TAKAAKI, HAYASHI TATSUYA, SHIONO ICHIRO, NAGAE EKISHU, MIYAUCHI MITSUSUKE, KYO YUSHO
• Format: Patent
• Language: English
• Published: 02.05.2013
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To provide a thin film forming apparatus that enables a reduction in operation time for thin film formation and a reduction in cost for the film forming operation by efficiently simplifying an operation of forming a thin film only on a specific portion on a number of substrates.SOLUTION: A substrate holding mechanism 3 provided in the thin film forming apparatus 100 includes: substrate holding members 10-40 which hold a plurality of substrates in a manner that a part of a non-film forming portion of a substrate overlaps the other substrate and a film forming portion is exposed; a support member 50 which supports the substrate holding members 10-40; and a rotation member 60 which rotates the support member 50. The substrate holding members 10-40 include: a plurality of holding surfaces which hold the plurality of substrates and are disposed between a film forming source 4 and the plurality of substrates; a plurality of step portions which are formed between the plurality of holding surfaces in a manner that ends of the plurality of substrates respectively come into contact with the step portions; and a plurality of opening portions which are formed on the holding surfaces of the portion corresponding to the film forming portion when the ends of the substrates come into contact with the plurality of the step portions.