NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, AND PROTECTIVE FILM AND TOUCH PANEL MEMBER USING THE SAME

PROBLEM TO BE SOLVED: To provide an alkali-developable negative photosensitive resin composition giving a cured film being excellent in pattern processability, having high hardness, high heat resistance and high heat resistance by UV curing and heat curing, and providing high moist heat resistance f...

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Bibliographic Details
Main Authors SUWA MITSUFUMI, ARAKI HITOSHI
Format Patent
LanguageEnglish
Published 25.04.2013
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
MATERIALS THEREFOR
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:PROBLEM TO BE SOLVED: To provide an alkali-developable negative photosensitive resin composition giving a cured film being excellent in pattern processability, having high hardness, high heat resistance and high heat resistance by UV curing and heat curing, and providing high moist heat resistance for suppressing corrosion of an underlaying metal.SOLUTION: A negative photosensitive resin composition contains (A) a carboxyl group-containing acryl resin, (B) a photoinitiator, (C) a polyfunctional monomer, (D) a polyfunctional epoxy compound having four or more aromatic rings and a quaternary carbon with three or more bonds to an aromatic ring.
Bibliography:Application Number: JP20110216290