FLAME RETARDANT RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a phosphazene compound capable of effectively improving the flame retardancy of a molded resin article, providing the molded resin article with excellent electrical properties, especially a low dielectric constant ( ) and dielectric loss tangent (tanδ), and having a...

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Bibliographic Details
Main Authors TADA YUJI, MORIYA NARIMASA, YANO HIROSHI, SUZUKI ATSUKO, KOYAMA SHIGETO
Format Patent
LanguageEnglish
Published 25.04.2013
Subjects
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
DYES
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:PROBLEM TO BE SOLVED: To provide a phosphazene compound capable of effectively improving the flame retardancy of a molded resin article, providing the molded resin article with excellent electrical properties, especially a low dielectric constant ( ) and dielectric loss tangent (tanδ), and having a high heat resistance.SOLUTION: There is provided a method for producing a cyclic phosphazene compound containing an ethenylphenoxy group and expressed by formula (1), comprising reaction steps to reduce a cyclic phosphazene compound containing acetylphenoxy group and dehydrate the obtained cyclic phosphazene compound containing hydroxyethylphenoxy group. In formula (1), n is an integer of 1-6; at least one A group is ethenylphenoxy expressed by formula (2); and the other A groups are aryloxy.
Bibliography:Application Number: JP20110215222