CHIP BEAD AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide: a chip bead that can prevent a short circuit and yield deterioration due to deformation, breakage, or the like by preventing a slack of a coil wound around a winding core; and a method of manufacturing the chip bead.SOLUTION: A chip bead 10 has a structure that a co...

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Bibliographic Details
Main Author NAKAMICHI TOSHIHIKO
Format Patent
LanguageEnglish
Published 04.04.2013
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Summary:PROBLEM TO BE SOLVED: To provide: a chip bead that can prevent a short circuit and yield deterioration due to deformation, breakage, or the like by preventing a slack of a coil wound around a winding core; and a method of manufacturing the chip bead.SOLUTION: A chip bead 10 has a structure that a coil 14 is wound around an octagonal prism-like winding core 12, and an armour 16 is formed to cover the outside of the coil 14, and terminal electrodes 18 and 20 are formed on both ends of the winding core 12. For example, ferrite magnetic material is used for the winding core 12 and the armour 16, and a silver wire is used for the coil 14. After an octagonal prism-like primary molded body is molded by primary molding of a mixture of magnetic materials, the coil 14 is wound before firing the primary molded body. Thereby, the coil 14 can be bitten into the corners of the octagonal prism, and can be wound therearound without allowing any slack. Thereafter, a secondary molded body covering the primary molded body and the coil 14 is molded by secondary molding of a mixture of magnetic materials, followed by firing.
Bibliography:Application Number: JP20110199517