COMPONENT BUILT-IN WIRING BOARD AND MANUFACTURING METHOD OF THE SAME

• Main Authors: TSUKADA TETSUJI, YAMASHITA DAISUKE, HIGO ICHIEI
• Format: Patent
• Language: English
• Published: 28.03.2013
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a component built-in wiring board which enables built-in components to be accurately positioned without performing a complicated process when the built-in components are housed in a housing part of a core substrate.SOLUTION: A component built-in wiring board 10 inclu...