COMPONENT BUILT-IN WIRING BOARD AND MANUFACTURING METHOD OF THE SAME

• Main Authors: TSUKADA TETSUJI, YAMASHITA DAISUKE, HIGO ICHIEI
• Format: Patent
• Language: English
• Published: 28.03.2013
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a component built-in wiring board which enables built-in components to be accurately positioned without performing a complicated process when the built-in components are housed in a housing part of a core substrate.SOLUTION: A component built-in wiring board 10 includes: a core substrate 11; a housing part 21 penetrating through the core substrate 11; a built-in component 50 housed in the housing part 21; and wiring lamination parts 12, 13 formed so as to be laminated on an upper surface and a lower surface of the core substrate 11. The housing part 21 is defined by an inner wall surface 20 of the core substrate 11 which includes first and second inner wall surfaces respectively formed in different directions in a plain view. The built-in component 50 is housed in the housing part 21 while partially contacting with the first and second inner wall surfaces. A resin filler F fills an area in a gap between the inner wall surface 20 and the built-in component 50 where the built-in component 50 does not contact with the first and second inner wall surfaces.