CIRCUIT CONNECTING MATERIAL, AND CONNECTED STRUCTURE USING THE SAME
PROBLEM TO BE SOLVED: To provide a radical curing type circuit connecting material, which is suppressed from forming bubbles at an interface between an adhesive layer and a silicon nitride membrane formed from a circuit connecting material, while satisfactorily preventing the variation of resistance...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | English |
Published |
28.03.2013
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | PROBLEM TO BE SOLVED: To provide a radical curing type circuit connecting material, which is suppressed from forming bubbles at an interface between an adhesive layer and a silicon nitride membrane formed from a circuit connecting material, while satisfactorily preventing the variation of resistance values between adjacent circuits when they are treated at high temperature and in a high moisture.SOLUTION: The circuit connecting material 1 lies between a pair of circuit members having circuit electrodes and arranged so that the circuit electrodes are facing each other, and is used for adhering the pair of circuit members to electrically connect each of the circuit electrodes. The circuit connecting material 1 comprises (1) a radical polymerization initiator, (2) a polyfunctional (meth)acrylic compound and (3) a monofunctional (meth)acrylic monomer having ≥100 and <210 molecular weight, wherein the blended amount of the monofunctional (meth)acrylic monomer is 9.4-25 pts.wt. in 100 pts.wt. of the total weight of the polyfunctional (meth)acrylic compound and the mono functional (meth) acrylic monomer. |
---|---|
Bibliography: | Application Number: JP20120219616 |