SUBSTRATE WITH BUILT-IN COMPONENT AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a substrate with a built-in component, in which an opening for incorporating an electronic component therein can be made small.SOLUTION: A substrate with a built-in component 10 includes: a first substrate 3A in which a first conductive layer 4c1 is formed on a first...

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Bibliographic Details
Main Authors OKAMOTO MASAHIRO, SANO NOBUNORI
Format Patent
LanguageEnglish
Published 21.03.2013
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide a substrate with a built-in component, in which an opening for incorporating an electronic component therein can be made small.SOLUTION: A substrate with a built-in component 10 includes: a first substrate 3A in which a first conductive layer 4c1 is formed on a first insulating layer 3c and an interlayer conduction part 1c2 is formed in the first insulating layer 3c; an electronic component 2 connected to the interlayer conduction part 1c2; and a second substrate 2A in which a second conductive layer 4b1 is formed on a second insulating layer 3b and which has an opening 6 at a position where the electronic component 2 is to be incorporated. The second conductive layer 4b1 includes a frame-shaped part 7b1 having a frame shape in a plan view. The opening 6 is formed to penetrate the second insulating layer 3b in the thickness direction in an entire inner region 8b1 of the frame-shaped part 7b1.
Bibliography:Application Number: JP20110190527