LIQUID INJECTION HEAD MANUFACTURING METHOD, LIQUID INJECTION HEAD, PIEZOELECTRIC ELEMENT MANUFACTURING METHOD AND PIEZOELECTRIC ELEMENT
PROBLEM TO BE SOLVED: To provide a liquid injection head manufacturing method which can improve displacement efficiency of a piezoelectric element and reduce manufacturing cost.SOLUTION: A liquid injection head manufacturing method comprises the steps of: forming either of an individual internal ele...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
21.03.2013
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a liquid injection head manufacturing method which can improve displacement efficiency of a piezoelectric element and reduce manufacturing cost.SOLUTION: A liquid injection head manufacturing method comprises the steps of: forming either of an individual internal electrode 16 or a common internal electrode 17 on each of a plurality of wafers of the same thickness formed by a piezoelectric material to form first and second wafers; alternately laminating the first wafers and the second wafers and applying pressure to unify the wafers, and subsequently calcinating the wafers; attaching the wafer to a dicing tape and cutting the wafers having piezoelectric material layers 15 unified by calcination of the laminated piezoelectric materials into predetermined size piezoelectric material layers; and forming an individual external electrode 22 connected to the individual internal electrodes 16 and a common external electrode 23 connected to the common internal electrodes 17 on a surface of the cut piezoelectric material layers 15. |
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Bibliography: | Application Number: JP20110190102 |