METHOD FOR PRODUCING COMPOSITION FOR SILICA RESIN FILM, COMPOSITION FOR SILICA RESIN FILM, METHOD FOR FORMING SILICA RESIN FILM, AND SILICA RESIN FILM

• Main Authors: SAWADA YOSHIHIRO, MASUJIMA MASAHIRO, YAMADAYA TOKUNORI, SHIMATANI SATOSHI
• Format: Patent
• Language: English
• Published: 07.03.2013
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

PROBLEM TO BE SOLVED: To provide a technology capable of improving crack resistance in a thick silica resin film formed by high-temperature firing.SOLUTION: A method for producing a composition for a silica resin film with a thickness of ≥2.0 μm to be formed by high-temperature firing at ≥500°C includes: a first process of promoting hydrolysis reaction of a first alkoxysilane represented by general formula (1) and dehydration condensation reaction of the resultant hydrolysis product of the first alkoxysilane; and a second process of compounding a second alkoxysilane represented by general formula (2) in a reaction system of the first process wherein the hydrolysis product of the first alkoxysilane remains and promoting hydrolysis reaction of the second alkoxysilane and dehydration condensation reaction of the resultant hydrolysis product of the second alkoxysilane, the dehydration condensation reaction product obtained in the first process, and the remaining hydrolysis product of the first alkoxysilane. The general formula (1) is (R)Si(OR). The general formula (2) is Si(OR).