OPTICAL ELEMENT PACKAGE, SURFACE LIGHT EMITTING LASER MODULE, OPTICAL SCANNER DEVICE, AND IMAGE FORMATION DEVICE

PROBLEM TO BE SOLVED: To provide a highly reliable optical element package which achieves high yield.SOLUTION: An optical element package comprises: a package where a recessed part is provided for installing an optical element emitting light; and a transparent substrate connecting with the package a...

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Bibliographic Details
Main Author HIROI MASAKI
Format Patent
LanguageEnglish
Published 28.02.2013
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Summary:PROBLEM TO BE SOLVED: To provide a highly reliable optical element package which achieves high yield.SOLUTION: An optical element package comprises: a package where a recessed part is provided for installing an optical element emitting light; and a transparent substrate connecting with the package at the light emission side of the optical element. The optical element is bonded to an installation region provided in the recessed part with a conductive adhesive, and a high surface energy member having surface energy higher than surface energy of the installation region is provided around the installation region. The optical element is bonded to the installation region with the conductive adhesive. The above problem is solved by providing the optical element package.
Bibliography:Application Number: JP20110177024