MULTILAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

• Main Author: SANO NOBUNORI
• Format: Patent
• Language: English
• Published: 28.02.2013
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a method of manufacturing a through wiring board capable of efficiently forming a through wire.SOLUTION: A multilayer wiring board 1 has a ground circuit 21 or a power supply circuit on one surface 11a of an insulation board 11, and at least one or more wiring boards...