MULTILAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a method of manufacturing a through wiring board capable of efficiently forming a through wire.SOLUTION: A multilayer wiring board 1 has a ground circuit 21 or a power supply circuit on one surface 11a of an insulation board 11, and at least one or more wiring boards...

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Bibliographic Details
Main Author SANO NOBUNORI
Format Patent
LanguageEnglish
Published 28.02.2013
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide a method of manufacturing a through wiring board capable of efficiently forming a through wire.SOLUTION: A multilayer wiring board 1 has a ground circuit 21 or a power supply circuit on one surface 11a of an insulation board 11, and at least one or more wiring boards 11α having a plurality of vias 31 for interlayer conduction that are connected with the ground circuit 21 or the power supply circuit. In at least one of the vias 31, a small hole penetrating through a conductor film forming the ground circuit 21 or the power supply circuit is provided to a connector between conductive paste configuring the vias 31 and the ground circuit 21 or the power supply circuit. The inside of the small hole is filled with the conductive paste.
Bibliography:Application Number: JP20110175866