OPTICAL DEVICE

PROBLEM TO BE SOLVED: To provide a small imaging device 1.SOLUTION: An imaging apparatus 1 includes: an image pick up device chip 20 where an image pick up device 22 is formed on a main surface 20S; a sealing member 10 for hermetically sealing the image pick up device 22; and an adhesive part 30 com...

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Bibliographic Details
Main Author YAMADA MASAFUMI
Format Patent
LanguageEnglish
Published 21.02.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a small imaging device 1.SOLUTION: An imaging apparatus 1 includes: an image pick up device chip 20 where an image pick up device 22 is formed on a main surface 20S; a sealing member 10 for hermetically sealing the image pick up device 22; and an adhesive part 30 composed of an adhesive 31 which joins the image pick up device chip 20 to the sealing member 10. In a hermetically sealing part, the protruding adhesive 31 spreads along a frame part 12 of the sealing member 10 in a main surface vertical direction relative to the main surface 20S direction.
Bibliography:Application Number: JP20110175316