PACKAGE, METHOD OF MANUFACTURING THE SAME, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC EQUIPMENT, AND RADIO-CONTROLLED CLOCK

• Main Author: FUNABIKI YOICHI
• Format: Patent
• Language: English
• Published: 07.02.2013
• Subjects: BASIC ELECTRIC ELEMENTS; BASIC ELECTRONIC CIRCUITRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a package which prevents a metal pin from being displaced while adequately securing working efficiency at the time of arranging the metal pin and to provide a piezoelectric vibrator, an oscillator, electronic equipment, and a radio-controlled clock.SOLUTION: The package has: a through hole 30 formed so as to penetrate a second surface U side (inside) of a wafer 40 for a base substrate (first substrate) and a first surface L side (outside) of the wafer 40 for the base substrate (first substrate); a metal pin 7 which is inserted through the through hole 30, and electrically connects the second surface U side (inside) of the wafer 40 for the base substrate (first substrate) with the first surface L side (outside) of the wafer 40 for the base substrate (first substrate); and a glass body (non-conductive filling member) for filling a gap between the through hole 30 and the metal pin 7. The package also has a positioning protrusion 7c for determining a relative position of the metal pin 7 with respect to the radial direction of the through hole 30 provided at one end in an axial direction of the metal pin 7.