CIRCUIT CONNECTION MATERIAL, AND CIRCUIT CONNECTION STRUCTURE USING THE SAME
PROBLEM TO BE SOLVED: To provide a circuit connection material exhibiting high adhesive strength, and capable of sufficiently suppressing the generation of peeling bubbles at an interface between a circuit member and the circuit connection material in the case of a connected body is left in a high-t...
Saved in:
Main Authors | , , , , , , , |
---|---|
Format | Patent |
Language | English |
Published |
07.02.2013
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Be the first to leave a comment!