CIRCUIT CONNECTION MATERIAL, AND CIRCUIT CONNECTION STRUCTURE USING THE SAME
PROBLEM TO BE SOLVED: To provide a circuit connection material exhibiting high adhesive strength, and capable of sufficiently suppressing the generation of peeling bubbles at an interface between a circuit member and the circuit connection material in the case of a connected body is left in a high-t...
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Format | Patent |
Language | English |
Published |
07.02.2013
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Abstract | PROBLEM TO BE SOLVED: To provide a circuit connection material exhibiting high adhesive strength, and capable of sufficiently suppressing the generation of peeling bubbles at an interface between a circuit member and the circuit connection material in the case of a connected body is left in a high-temperature high humidity environment.SOLUTION: The circuit connection material contains (a) a thermoplastic resin, (b) a radical polymerizable compound, and (c) a radical polymerization initiator, wherein (b) the radical polymerizable compound is represented by formula (1), and satisfies the condition of the following expression (I): 10≤S2/S1≤14, wherein S1 is an integral value of a spectrum measured in the chemical shift value of 2.75 to 3.10 ppm inHNMR with tetramethylsilane as an internal standard; and S2 is an integral value thereof in 3.90 to 4.25 ppm. In the formula (1), Ris a hydrogen atom or a methyl group; j is an integer of 1 to 3; k is an integer of 2 to 7; m is an integer of 4 to 8; and n is an integer of 5 to 7. |
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AbstractList | PROBLEM TO BE SOLVED: To provide a circuit connection material exhibiting high adhesive strength, and capable of sufficiently suppressing the generation of peeling bubbles at an interface between a circuit member and the circuit connection material in the case of a connected body is left in a high-temperature high humidity environment.SOLUTION: The circuit connection material contains (a) a thermoplastic resin, (b) a radical polymerizable compound, and (c) a radical polymerization initiator, wherein (b) the radical polymerizable compound is represented by formula (1), and satisfies the condition of the following expression (I): 10≤S2/S1≤14, wherein S1 is an integral value of a spectrum measured in the chemical shift value of 2.75 to 3.10 ppm inHNMR with tetramethylsilane as an internal standard; and S2 is an integral value thereof in 3.90 to 4.25 ppm. In the formula (1), Ris a hydrogen atom or a methyl group; j is an integer of 1 to 3; k is an integer of 2 to 7; m is an integer of 4 to 8; and n is an integer of 5 to 7. |
Author | YOKOTA KOICHI KUDO SUNAO NAMATAME YUTAKA KOBAYASHI KOJI KATOGI SHIGEKI SHIBATA O IZAWA HIROYUKI FUJITA SACHIKO |
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Snippet | PROBLEM TO BE SOLVED: To provide a circuit connection material exhibiting high adhesive strength, and capable of sufficiently suppressing the generation of... |
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SubjectTerms | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON CURRENT COLLECTORS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES |
Title | CIRCUIT CONNECTION MATERIAL, AND CIRCUIT CONNECTION STRUCTURE USING THE SAME |
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