SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To prevent short circuits and leaks due to the misalignment of lead wiring.SOLUTION: A semiconductor device includes: first inner lead wiring 10a where a joining part, joining with a first protruding electrode 6a, has a width in a first direction which is larger than the width...

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Bibliographic Details
Main Author ASAYAMA YOSHIAKI
Format Patent
LanguageEnglish
Published 04.02.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To prevent short circuits and leaks due to the misalignment of lead wiring.SOLUTION: A semiconductor device includes: first inner lead wiring 10a where a joining part, joining with a first protruding electrode 6a, has a width in a first direction which is larger than the width of the first protruding electrode 6a when the arrangement direction of the first protruding electrode 6a and a second protruding electrode 6b is referred to as the first direction; and second inner lead wiring 10b joined to the second protruding electrode 6b.
Bibliography:Application Number: JP20110157170