SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To prevent the occurrence of dendrite between electrode pads.SOLUTION: A semiconductor device has a first electrode pad 1a, a second electrode pad 1b, and a metal-film pattern 3 disposed between the first electrode pad 1a and the second electrode pad 1b. (1) The metal-film patt...

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Bibliographic Details
Main Author TAJIMA KAZUHISA
Format Patent
LanguageEnglish
Published 04.02.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To prevent the occurrence of dendrite between electrode pads.SOLUTION: A semiconductor device has a first electrode pad 1a, a second electrode pad 1b, and a metal-film pattern 3 disposed between the first electrode pad 1a and the second electrode pad 1b. (1) The metal-film pattern 3 is electrically connected to the first electrode pad 1a or the same potential as the first electrode pad 1a is applied to the metal-film pattern 3, and (2) the metal-film pattern 3 is covered with an insulating film (a protective insulating film 2).
Bibliography:Application Number: JP20110156236