SURFACE TREATMENT METHOD FOR CONDUCTIVE BASE MATERIAL FOR MOUNTING TAPE CARRIER-FITTED SEMICONDUCTOR, CONDUCTIVE BASE MATERIAL FOR MOUNTING TAPE CARRIER-FITTED SEMICONDUCTOR OBTAINED BY USING THE TREATMENT METHOD, AND SEMICONDUCTOR PACKAGE

• Main Authors: INOUE FUMIO, SAKAYORI KAZUHIKO, YAMASHITA TOMOAKI, HIROYAMA YUKIHISA
• Format: Patent
• Language: English
• Published: 04.02.2013
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide: a surface treatment method for a conductive base material for mounting a tape carrier-fitted semiconductor which can improve reliability and adhesive properties with a sealing material; a conductive base material for mounting a tape carrier-fitted semiconductor obtained by using the treatment method; and a semiconductor package obtained by using them.SOLUTION: The surface treatment method for a conductive base material for mounting a tape carrier-fitted semiconductor includes a first roughening step of bringing a conductive base material for mounting a tape carrier-fitted semiconductor into contact with a first chemical roughening liquid including a corrosion inhibitor to form a roughened shape on the surface of the conductive base material for mounting a semiconductor. The surface treatment method for a conductive base material for mounting a tape carrier-fitted semiconductor further includes a second roughening step of bringing the same into contact with a second chemical roughening liquid including a corrosion inhibitor after the first roughening step. The conductive base material for mounting a tape carrier-fitted semiconductor is obtained by using the surface treatment. The semiconductor package is obtained by using them.