THERMAL CONDUCTIVE COMPOSITION AND THERMAL CONDUCTIVE SHEET OBTAINED BY TREATING THE SAME

• Main Authors: ICHINOSE MASANOBU, KURITA SUMIHIKO, KOBAYASHI KAZUTERU
• Format: Patent
• Language: English
• Published: 04.02.2013
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide a thermal conductive composition easy in manufacture, excellent in the improvement of the thermal conductivity and heat resistance, having high flexibility and capable of forming a thin sheet; and to provied a thermal conductive sheet obtained by treating the same.SOLUTION: The thermal conductive composition having 0.5-400 W/m K thermal conductivity is obtained by adding 30-1,500 pts.mass filler to 100 pts.mass fluororesin in which melting extrusion molding is possible, other than polytetrafluoro ethylene (PTFE) and poly vinyl fluoride (PVF). Because the filler having various characteristics is added easily and in a large quantity into the fluororesin, the thermal conductive composition is easily manufactured, is capable of easily exhibiting the characteristics of the filler, has improved thermal conductivity, excellent heat dissipation, satisfactory heat resistance and durability and high flexibility, and is capable of forming even a thin sheet.