SEMICONDUCTOR ELEMENT MOUNTING MEMBER

PROBLEM TO BE SOLVED: To provide a semiconductor device, especially a semiconductor device on which an LED semiconductor element is mounted, which is excellent in thermal conductivity and connection reliability, and capable of thinning to a higher degree.SOLUTION: A semiconductor element mounting me...

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Bibliographic Details
Main Authors INADA TEIICHI, NAOYUKI SUSUMU
Format Patent
LanguageEnglish
Published 24.01.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a semiconductor device, especially a semiconductor device on which an LED semiconductor element is mounted, which is excellent in thermal conductivity and connection reliability, and capable of thinning to a higher degree.SOLUTION: A semiconductor element mounting member has a conductive metal layer pattern on an adhesive layer side of a carrier substrate including a detachable base material and the adhesive layer. The metal layer pattern has a cross sectional shape such that an outermost peripheral part of the metal layer pattern protrudes from a part where the metal layer pattern and the adhesive layer are in contact with each other to the outside when viewed from the side of the metal layer pattern of the member.
Bibliography:Application Number: JP20110150500