SEMICONDUCTOR ELEMENT MOUNTING MEMBER, SEMICONDUCTOR ELEMENT MOUNTED SUBSTRATE AND SEMICONDUCTOR DEVICE

• Main Authors: INADA TEIICHI, NAOYUKI SUSUMU
• Format: Patent
• Language: English
• Published: 24.01.2013
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a semiconductor device, especially a semiconductor device on which an LED semiconductor element is mounted, which is excellent in thermal conductivity and connection reliability, and capable of thinning to a higher degree.SOLUTION: A semiconductor element mounting member has a conductive metal layer pattern and an insulation part on a carrier substrate composed of a detachable base material and an adhesive layer. The detachable base material is composed of stainless steel. The metal layer pattern is covered by the insulation part at least on a peripheral edge so as to have an exposed part in a portion of the metal layer pattern. The metal layer pattern has a cross sectional shape such that an outermost peripheral part of the metal layer pattern protrudes from a part where the metal layer pattern and the carrier substrate are in contact with each other to the insulation part side when viewed from the side of the metal layer pattern of the member.