PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF MANUFACTURING PATTERN-CURED FILM USING THE SAME, AND ELECTRONIC COMPONENT

• Main Authors: MOTOBE TAKEHARU, NAKAMURA YUKI, OE TADAYUKI, MINEGISHI TOMONORI, MATSUYA NORITAKA
• Format: Patent
• Language: English
• Published: 24.01.2013
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that can be used to manufacture a pattern-cured film excellent in chemical resistance and substrate adhesiveness to a copper substrate or the like.SOLUTION: The photosensitive resin composition contains: (a) a polymer soluble in an aqueous alkaline solution, (b) a compound that generates acid by means of light, (c) a compound having an oxetanyl group and (d) a crosslinking agent, where with respect to 100 pts.mass of the component (a), 1-100 pts.mass of the component (b), 0.1-20 pts.mass of the component (c), and 10-40 pts.mass of the component (d) are contained respectively.