MANUFACTURING METHOD OF CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit board capable of reducing dropping off of a solder resist and highly accurately improving a yield and reliability even when non-contact pattern exposure is applied to an unexposed solder resist.SOLUTION: A manufacturing method of a...

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Bibliographic Details
Main Authors TSUBOMATSU YOSHIAKI, SAKURAI TAKEHISA, NAMATAME KAZUHIKO
Format Patent
LanguageEnglish
Published 10.01.2013
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit board capable of reducing dropping off of a solder resist and highly accurately improving a yield and reliability even when non-contact pattern exposure is applied to an unexposed solder resist.SOLUTION: A manufacturing method of a circuit board having a circuit pattern 3 covered by a solder resist pattern 20 comprises the steps of: forming an unexposed solder resist 12 on the circuit pattern 3; forming a pattern-exposed solder resist by performing contact pattern exposure and non-contact pattern exposure for the unexposed solder resist 12; and forming the target solder resist pattern 20 by developing the pattern-exposed solder resist.
Bibliography:Application Number: JP20110141721