THIN-FILM CAPACITOR, MULTILAYER WIRING BOARD AND SEMICONDUCTOR DEVICE

• Main Author: ROKUHARA MASAHITO
• Format: Patent
• Language: English
• Published: 10.01.2013
• Subjects: BASIC ELECTRIC ELEMENTS; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a thin-film capacitor, a multilayer wiring board and a semiconductor device which can reduce inductance while suppressing reduction of the effective electrode area, and realize miniaturization.SOLUTION: A thin-film capacitor comprises: plural first capacitative elements each having an electrode layer with a first polarity on an upper surface of a dielectric layer and an electrode layer with a second polarity on a lower surface of the dielectric layer and arranged around a specific position; plural second capacitative elements each having an electrode layer with the second polarity on the upper surface of the dielectric layer and an electrode layer with the first polarity on the lower surface of the dielectric layer and arranged around the specific position alternately with the first capacitative elements; a single common connection hole at the specific position connecting all electrode layers with the first polarity of the first capacitative elements and all electrode layers with the first polarity of the second capacitative elements; and plural individual connection holes around the common connection hole connecting each electrode layer with the second polarity of the first capacitative elements to an electrode layer with the second polarity of the adjacent second capacitative elements.