SIDE-MOUNTING LED

• Main Author: KAMIJO YU
• Format: Patent
• Language: English
• Published: 10.01.2013
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a side-mounting LED which can obtain a sufficient heat dissipation effect by increasing a surface electrically grounded to a motherboard and can also optimally regulate the range and amount of solder application at the time of packaging.SOLUTION: A side-mounting LED 11 comprises: a substrate 12 having a front face, a back face, and a peripheral face formed between the front face and the back face; front electrodes and back electrodes 16a and 16b respectively formed on the front face and the back face of the substrate 12; a light-emitting element arranged on the front face of the substrate 12; and through-holes 14a and 14b which are formed on part of the peripheral face of the substrate 12, and which bring the front electrodes into conduction with the back electrode 16a and 16b. The back electrode 16a and 16b are formed substantially in the entire range of the back face of the substrate 12. A resist pattern 20 is formed on the surfaces of the back electrode 16a and 16b. The resist pattern 20 exposes solder application surfaces 22a and 22b excluding part of the back electrodes 16a and 16b which surrounds the through-holes 14a and 14b.