STACKED CHIP ELEMENT AND METHOD FOR MANUFACTURING THE SAME

• Main Authors: KIM DONG-GUN, KIM DOO YOUNG, KIM HYUN-WOO, YIM HYUN-KYU, JIN YONG-SIK, SIN JONG-BOM, SIM HYUN-KYU
• Format: Patent
• Language: English
• Published: 07.01.2013
• Subjects: BASIC ELECTRIC ELEMENTS; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; ELECTRICITY

PROBLEM TO BE SOLVED: To provide a stacked chip element and a method for manufacturing the same.SOLUTION: There are disclosed a stacked chip element and a method for manufacturing the stacked chip element. The stacked chip element of the present invention includes: a stacked body comprising a plurality of stacked sheets each of which has an internal electrode formed of a conductive substance; external electrodes provided at both sides of the stacked body; and connection electrodes extending from the internal electrode and electrically connecting the internal electrode with the external electrodes. The connection electrodes include: a plating solution permeation preventing section extending from the internal electrode, however, extending with a thickness smaller than the thickness of the internal electrode; and a contact reinforcement section extending from the plating solution permeation preventing section, however, extending in such a form that the thickness thereof is gradually increased toward the external electrode. According to the present invention, a plating solution can be prevented from permeating an internal electrode from the outside, durability against thermal shock can be improved, and contact property between the internal electrode and an external electrode can be increased.