HEAT DISSIPATION UNIT

PROBLEM TO BE SOLVED: To provide a heat dissipation unit which has a low cost intermediate that hardly deteriorates while reconciling heat conductivity with insulation properties and can efficiently dissipate heat of a heating element.SOLUTION: A heat dissipation unit 1 comprises: a heat dissipation...

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Bibliographic Details
Main Authors NAGANO MITSUYOSHI, MINAMISAWA HIROSHI, IWASAKO YASUSHI, UENO SUKETSUGU
Format Patent
LanguageEnglish
Published 07.01.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a heat dissipation unit which has a low cost intermediate that hardly deteriorates while reconciling heat conductivity with insulation properties and can efficiently dissipate heat of a heating element.SOLUTION: A heat dissipation unit 1 comprises: a heat dissipation part 5 for discharging heat conducted from a heating element 2; and an intermediate 4 for conducting the heat from the heating element 2 to the heat dissipation part 5, in which the intermediate 4 has a phase of an inorganic substance particle and an inorganic combination phase disposed around the phase of the inorganic substance particle, the inorganic combination phase includes an inorganic material formed by subjecting metal alkoxide to hydrolysis and dehydration polymerization, metallic elements making the metal alkoxide include at least one element selected from a group of Al, Mg, Si, Ti, Zr and Be, and the intermediate 4 joins to a surface of the heat dissipation part 5.
Bibliography:Application Number: JP20110135820