RESIN COMPOSITION, PREPREG, AND METHOD OF PRODUCING THE PREPREG

PROBLEM TO BE SOLVED: To provide a resin composition that can exhibit excellent electric characteristics, wherein many of the resin compositions can be held on a substrate; a prepreg obtained by using the resin composition; and a method of producing the prepreg.SOLUTION: The resin composition compri...

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Bibliographic Details
Main Author TOBISAWA AKIHIKO
Format Patent
LanguageEnglish
Published 27.12.2012
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
GENERAL PROCESSES OF COMPOUNDING
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
WORKING-UP
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Summary:PROBLEM TO BE SOLVED: To provide a resin composition that can exhibit excellent electric characteristics, wherein many of the resin compositions can be held on a substrate; a prepreg obtained by using the resin composition; and a method of producing the prepreg.SOLUTION: The resin composition comprises a thermosetting resin and an inorganic filler. The inorganic filler has: a first inorganic filler that consists of silica; and a second inorganic filler that consists of a silicon powder. Moreover, the content of the thermosetting resin is 40 to 60 mass% of the whole resin composition.
Bibliography:Application Number: JP20110127708